• DocumentCode
    136574
  • Title

    Anti-demagnetization modeling of interior permanent magnet motor by bidirectional magnetic network

  • Author

    Shi Wei ; Zhang Zhouyun ; Zhang Yunhuan

  • Author_Institution
    Shanghai Univ. of Eng. Sci., Shanghai, China
  • fYear
    2014
  • fDate
    Aug. 31 2014-Sept. 3 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper aims at the irreversible demagnetization phenomenon of interior permanent magnet synchronous motor (IPMSM). The author considers the main demagnetization factors of temperature and magnetic field distribution in IPMSM. The anti-demagnetization bidirectional magnetic network model of IPMSM is constructed by bidirectional magnetic network element, which can calculate distribution of radial and circumferential magnetic field lines. Basic characteristics and the anti-demagnetization capability of IPMSM are simulated based on the design. Then optimized result is obtained considering anti-demagnetization capacity and economy of IPMSM. The simulation results are compared with the finite element method (FEM) and experimental data with high precision.
  • Keywords
    demagnetisation; finite element analysis; magnetic fields; permanent magnet motors; synchronous motors; temperature distribution; FEM; IPMSM; anti-demagnetization modeling; bidirectional magnetic network element; bidirectional magnetic network model; circumferential magnetic field lines; demagnetization factors; finite element method; interior permanent magnet synchronous motor; irreversible demagnetization phenomenon; magnetic field distribution; radial magnetic field lines; temperature distribution; Demagnetization; Magnetic circuits; Magnetic flux; Magnetic separation; Rotors; Saturation magnetization; Stators; Anti-demagnetization; Bidirectional Magnetic Network; Interior Permanent Magnet Synchronous motor; Permanent Magnet (PM);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-4240-4
  • Type

    conf

  • DOI
    10.1109/ITEC-AP.2014.6940845
  • Filename
    6940845