DocumentCode :
1365869
Title :
1.05-GHz CMOS oscillator based on lateral- field-excited piezoelectric AlN contour- mode MEMS resonators
Author :
Zuo, Chengjie ; Van der Spiegel, Jan ; Piazza, Gianluca
Author_Institution :
Dept. of Electr. & Syst. Eng., Univ. of Pennsylvania, Philadelphia, PA, USA
Volume :
57
Issue :
1
fYear :
2010
Firstpage :
82
Lastpage :
87
Abstract :
This paper reports on the first demonstration of a 1.05-GHz microelectromechanical (MEMS) oscillator based on lateral-field-excited (LFE) piezoelectric AlN contourmode resonators. The oscillator shows a phase noise level of -81 dBc/Hz at 1-kHz offset frequency and a phase noise floor of -146 dBc/Hz, which satisfies the global system for mobile communications (GSM) requirements for ultra-high frequency (UHF) local oscillators (LO). The circuit was fabricated in the AMI semiconductor (AMIS) 0.5-??m complementary metaloxide- semiconductor (CMOS) process, with the oscillator core consuming only 3.5 mW DC power. The device overall performance has the best figure-of-merit (FoM) when compared with other gigahertz oscillators that are based on film bulk acoustic resonator (FBAR), surface acoustic wave (SAW), and CMOS on-chip inductor and capacitor (CMOS LC) technologies. A simple 2-mask process was used to fabricate the LFE AlN resonators operating between 843 MHz and 1.64 GHz with simultaneously high Q (up to 2,200) and kt 2 (up to 1.2%). This process further relaxes manufacturing tolerances and improves yield. All these advantages make these devices suitable for post-CMOS integrated on-chip direct gigahertz frequency synthesis in reconfigurable multiband wireless communications.
Keywords :
CMOS integrated circuits; UHF oscillators; aluminium compounds; bulk acoustic wave devices; micromechanical devices; surface acoustic wave resonators; AMI semiconductor; AlN; CMOS on-chip inductor and capacitor; CMOS oscillator; complementary metal-oxide-semiconductor process; figure-of-merit; film bulk acoustic resonator; frequency 1 kHz; frequency 1.05 GHz; frequency 1.64 GHz; frequency 843 MHz; global system for mobile communications; lateral-field-excited piezoelectric contour-mode MEMS resonators; microelectromechanical oscillator; post-CMOS integrated on-chip direct gigahertz frequency synthesis; power 3.5 mW; reconfigurable multiband wireless communications; size 0.5 mum; surface acoustic wave; ultra-high frequency local oscillators; Ambient intelligence; CMOS process; CMOS technology; Circuits; Film bulk acoustic resonators; Frequency; GSM; Local oscillators; Micromechanical devices; Phase noise; Acoustics; Aluminum Compounds; Computer-Aided Design; Equipment Design; Equipment Failure Analysis; Micro-Electrical-Mechanical Systems; Microwaves; Oscillometry; Reproducibility of Results; Semiconductors; Sensitivity and Specificity; Transducers; Vibration;
fLanguage :
English
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/TUFFC.1382
Filename :
5361526
Link To Document :
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