DocumentCode :
13659
Title :
Metallic Glass Hemispherical Shell Resonators
Author :
Kanik, Michael ; Bordeenithikasem, Punnathat ; Kim, Dennis ; Selden, Nate ; Desai, Amish ; M´closkey, Robert ; Schroers, Jan
Author_Institution :
Dept. of Mech. Eng. & Mater. Sci., Yale Univ., New Haven, CT, USA
Volume :
24
Issue :
1
fYear :
2015
fDate :
Feb. 2015
Firstpage :
19
Lastpage :
28
Abstract :
By utilizing bulk metallic glasses´ (BMGs) unique combination of amorphous structure, material properties, and fabrication opportunities, ultrasmooth and symmetric 3-D metallic glass resonators that are complimentary metal oxide semiconductor (CMOS) post-processing compatible are fabricated. Surface roughness to size ratio fabrication precision in the order of 100 parts per billion is demonstrated with a 3-mm diameter Pt57.5Cu14.7Ni5.3P22.5 BMG hemispherical shell with a thickness variation <;100 nm and a surface roughness of <;1 nm Ra. The resonator exhibits a resonant frequency of 13.9440 kHz ± 0.1 Hz with 0.035% frequency mismatch between degenerate N = 2 wineglass modes with a quality factor of 6200. This performance was obtained in the asmolded state without any device tuning or trimming. Another resonator with N = 2 resonant modes at 9.393 and 9.401 kHz, and quality factors of 7800 and 6500 was mounted into an integrated electrode system. Electrical readout by capacitive sensing in both time and frequency domains showed a resonance shift to 9.461 and 9.483 kHz, respectively. The quality factor was reduced to 5400 and 5300, respectively. This investigation demonstrates that BMG resonators may serve as a basis for robust microelectromechanical systems resonator devices with increased performance and low-cost fabrication techniques that exploits the atomic structure, unique softening behavior, strength, formability, and toughness of metallic glasses.
Keywords :
microfabrication; micromechanical resonators; BMG hemispherical shell; BMG resonators; CMOS post-processing; amorphous structure; asmolded state; atomic structure; bulk metallic glass; capacitive sensing; complimentary metal oxide semiconductor post-processing; electrical readout; fabrication opportunities; frequency 13.9440 kHz; frequency 9.393 kHz; frequency 9.401 kHz; frequency domain; frequency mismatch; integrated electrode system; low-cost fabrication technique; material properties; metallic glass formability; metallic glass hemispherical shell resonators; metallic glass strength; metallic glass toughness; quality factor; resonance shift; resonant frequency; robust microelectromechanical system resonator devices; surface roughness-size ratio fabrication precision; symmetric 3D metallic glass resonators; time domain; ultrasmooth 3D metallic glass resonators; unique softening behavior; wineglass mode; Electrodes; Fabrication; Glass; Metals; Optical resonators; Resonant frequency; Blow molding; bulk metallic glasses (BMGs); microelectromechanical systems (MEMS); microfabrication; resonators; thermoplastic forming; thermoplastic forming.;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2014.2363581
Filename :
6937058
Link To Document :
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