• DocumentCode
    1366089
  • Title

    Solid state: In smarter design and fabrication of ICs, power and logic are mixed on the same chip and circuits are integrated over an entire wafer

  • Author

    Fischetti, M.A.

  • Volume
    22
  • Issue
    1
  • fYear
    1985
  • Firstpage
    60
  • Lastpage
    64
  • Abstract
    Developments in microelectronics during 1984 are reviewed. These include: mixing power and logic on the same chip; progress in wafer-scale integration; new packages that improve on DIPs; and fast design turnaround springing from the availability of relatively inexpensive silicon compilers for commercial IC design.
  • Keywords
    CMOS integrated circuits; VLSI; circuit layout CAD; digital integrated circuits; field effect integrated circuits; insulated gate field effect transistors; 1984; commercial IC design; digital integrated circuits; dual-inline packages; fast design turnaround; field effect integrated circuits; microelectronics; power/logic mixing on same chip; silicon compilers; wafer-scale integration; CMOS integrated circuits; Companies; Integrated circuit interconnections; Logic gates; Pins; Standards; Very high speed integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.1985.6370530
  • Filename
    6370530
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1366089