Full wave three-dimensional simulation of Maxwell´s equations for the electrical characterization of high-speed interconnects

Author

German, Fred J. ; Johnson, R. Wayne

Author_Institution

Dept. of Electr. Eng., Auburn Univ., IL, USA

Volume

13

Issue

2

fYear

1990

fDate

6/1/1990 12:00:00 AM

Firstpage

341

Lastpage

346

Abstract

A complete three-dimensional full wave time-domain analysis of microstrip-type interconnections is presented. The analysis technique used in the transmission line matrix (TLM) method of electromagnetic simulation using the newly developed symmetrical condensed node. No TEM-quasistatic assumptions are required; therefore, all electromagnetic interactions-such as surface waves and radiation effects-are accounted for. Several practical structures are examined, and comparisons are made to other methods and with measurements where available

Keywords

hybrid integrated circuits; strip lines; transmission line theory; 3D full-wave time-domain analysis; characteristic impedance; electrical characterization of high-speed interconnects; electromagnetic simulation; measurements; microstrip-type interconnections; practical structures; radiation effects; simulation of Maxwell´s equations; surface waves; symmetrical condensed node; transmission line matrix; Analytical models; Electromagnetic analysis; Electromagnetic radiation; Electromagnetic scattering; Maxwell equations; Microstrip; Surface waves; Symmetric matrices; Time domain analysis; Transmission line matrix methods;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.56167

Filename

56167