Full wave three-dimensional simulation of Maxwell´s equations for the electrical characterization of high-speed interconnects

A complete three-dimensional full wave time-domain analysis of microstrip-type interconnections is presented. The analysis technique used in the transmission line matrix (TLM) method of electromagnetic simulation using the newly developed symmetrical condensed node. No TEM-quasistatic assumptions are required; therefore, all electromagnetic interactions-such as surface waves and radiation effects-are accounted for. Several practical structures are examined, and comparisons are made to other methods and with measurements where available