Title :
Benzocyclobutene interlayer dielectrics for thin film multichip modules
Author :
Johnson, R. Wayne ; Phillips, Timothy L. ; Weidner, William K. ; Hahn, Stephen F. ; Burdeaux, David C. ; Townsend, Paul H.
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., IL, USA
fDate :
6/1/1990 12:00:00 AM
Abstract :
An organic dielectric derived from benzocyclobutene has been investigated as an interlayer dielectric for thin-film multichip modules. The material is processed using standard semiconductor techniques. Key attributes of the polymer are a low dielectric constant (2.7), low moisture absorption (0.2-0.3%), low processing temperature (250°C), good chemical resistance, and high thermal stability (approximately 350°C). The material provides an alternative to polyimide as a thin-film insulator
Keywords :
dielectric thin films; hybrid integrated circuits; integrated circuit technology; materials testing; organic insulating materials; 250 C; 350 C; alternative to polyimide; benzocyclobutene; chemical resistance; interlayer dielectric; low dielectric constant; low moisture absorption; low permittivity; low processing temperature; organic dielectric; thermal stability; thin film multichip modules; thin-film insulator; Absorption; Dielectric constant; Dielectric materials; Dielectric thin films; Moisture; Multichip modules; Polymer films; Semiconductor materials; Semiconductor thin films; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
