New developed of thin plastic package with high terminal counts

Author

Kohara, Masanobu ; Nakao, Shin ; Yasunaga, Masatoshi ; Nemoto, Yoshihiko ; Nakagawa, Osamu ; Shimamoto, Haruo ; Tsutsumi, Yasutsugu

Author_Institution

Mitsubishi Electr. Corp., Hyogo, Japan

Volume

13

Issue

2

fYear

1990

fDate

6/1/1990 12:00:00 AM

Firstpage

401

Lastpage

406

Abstract

A small and thin quad flat package (QFP)-type plastic package for large-scale integrated (LSI) logic devices with high pin counts has been developed. The size of the package with 252 input and output pins is 17.3 mm by 17.3 mm, and the thickness is 1.52 mm. The pitch and the width of the leads are 0.25 and 0.1 mm, respectively. The main technologies for assembly of the package are tape automated bonding (TAB) interconnection technology, which has been developed for bonding of high-terminal-count LSIs, and the molding technology, which has also been developed for very small and thin plastic packages. The reliability of the package and the outer lead bonding of the package were evaluated, and it was confirmed that both the package and the bonding have no problem in the pressure cooker test (PCT), the temperature cycle test, and the high-temperature-storage test

Keywords

integrated logic circuits; large scale integration; lead bonding; packaging; LSIs; high-temperature-storage test; interconnection technology; logic devices; molding technology; outer lead bonding; pin counts; pressure cooker test; quad flat package; tape automated bonding; temperature cycle test; terminal counts; thin plastic package; Plastic packaging;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.56175

Filename

56175