Analysis of the dynamic phenomena during lamination of multilayer printed circuit board by the measurement of pressure distribution

In order to develop improved methods for manufacturing multilayer printed circuit boards (MLPCBs), it is necessary to understand the dynamic phenomena that occur during the lamination process. For this purpose, the authors have performed direct measurement of the pressure distribution in MLPCB laminates during curing by the application of their own force sensor technique and have concluded that the dynamic phenomena that occur during the lamination process can be explained on a large scale by the Newtonian fluid flow model, the friction affected mass model, and the elastic springback model. Synthesizing the knowledge acquired in this study makes it possible to manufacture MLPCBs with larger dimensions, higher density, and more layers