• DocumentCode
    1368642
  • Title

    Theoretical and experimental analysis of wire segment holograms for statistical interconnect metrology

  • Author

    AbuGhazaleh, Shadi A. ; Stevenson, J.T.M. ; Christie, Phillip ; Walton, Anthony J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
  • Volume
    11
  • Issue
    2
  • fYear
    1998
  • fDate
    5/1/1998 12:00:00 AM
  • Firstpage
    225
  • Lastpage
    231
  • Abstract
    Theoretical and experimental results using computer generated wire segment holograms for statistical interconnect metrology are presented. Test structures have been constructed using a process capable of imaging 1-μm features and consist of arrays of wire segments illuminated by a He-Ne Laser. Since the holograms are fabricated at the same time as actual wires on the wafer, the quality of the projected image correlates with the emergence of global feature patterning errors. Specifically, this paper presents data on the effect of varied exposure time on the intensity of the projected image. An initial statistical analysis indicates that the test structures are capable of detecting variations in wire geometry which are approximately 1.0% of the nominal wire width. It is anticipated that significant improvements to this level of sensitivity can be obtained by optimization of the holographic encoding process and test image selection
  • Keywords
    computer-generated holography; feature extraction; integrated circuit interconnections; integrated circuit measurement; statistical analysis; exposure time; global feature patterning errors; holographic encoding process; projected image; statistical analysis; statistical interconnect metrology; test image selection; wire geometry; wire segment holograms; wire segments; Geometry; Holography; Image coding; Image segmentation; Laser theory; Metrology; Optical arrays; Statistical analysis; Testing; Wire;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.670166
  • Filename
    670166