DocumentCode :
1368885
Title :
Focus characterization using end of line metrology
Author :
Leroux, Pierre ; Ziger, David ; Juig, Noris
Author_Institution :
Philips Semicond., San Antonio, TX, USA
Volume :
13
Issue :
3
fYear :
2000
fDate :
8/1/2000 12:00:00 AM
Firstpage :
322
Lastpage :
330
Abstract :
A new method is introduced to measure relative focus using conventional optical overlay instruments. Optical end of line metrology (OELM), is based on patterning a wide frame in which adjacent sides are constructed of submicron sized lines that run perpendicular to the center opening. Because truncation is size dependent, line and space features exhibit significantly more line shortening effects than the solid sections. When measured with a conventional optical overlay tool, the difference in line shortening between the solid and line and space sections are measured as an alignment offset, which is a relative measure of actual line shortening. Reproducibility for measuring the apparent misalignment of these modified box-in-box structures was 3 nm (3σest), which is similar to the repeatability for measuring conventional resist box in box alignment boxes. Truncation is sensitive to focus and the utility for using OELM toward characterizing focus-dependent lens parameters was investigated. Estimated 3σ for calculating best focus and astigmatism were 0.04 μm and 0.01 μm, respectively. Focus corrections were accurate to 0.05 μm within ±0.3 μm of best focus. Additionally, a general method is presented to estimate the error in the calculated best focus
Keywords :
aberrations; focusing; integrated circuit measurement; lenses; photolithography; alignment offset; astigmatism; box-in-box structures; focus characterization; lens parameters; line shortening effects; optical end of line metrology; optical overlay instruments; photolithography; relative focus; submicron sized lines; Focusing; Gratings; Instruments; Lenses; Metrology; Optical scattering; Optical sensors; Resists; Scanning electron microscopy; Solids;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.857943
Filename :
857943
Link To Document :
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