DocumentCode
1368891
Title
Device dependent control of chemical-mechanical polishing of dielectric films
Author
Patel, Nital S. ; Miller, Gregory A. ; Guinn, Christopher ; Sanchez, Adriana Cruz ; Jenkins, Steven T.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
Volume
13
Issue
3
fYear
2000
fDate
8/1/2000 12:00:00 AM
Firstpage
331
Lastpage
343
Abstract
This paper presents a control scheme for run-to-run control of chemical-mechanical polishing (CMP). The control scheme tracks both device pattern dependent and equipment induced disturbances. The structure of the controller is such that sensitivity to qual (unpatterned blanket oxide) wafer frequency is minimized. Additionally, prethickness variation and metrology delay are accounted for in the design. Results from applying this scheme in volume production are presented
Keywords
chemical mechanical polishing; dielectric thin films; integrated circuit manufacture; process control; chemical-mechanical polishing; device dependent control; dielectric films; equipment induced disturbances; metrology delay; prethickness variation; run-to-run control; unpatterned blanket oxide; volume production; Chemicals; Delay; Dielectric films; Frequency; Metrology; Planarization; Production; Semiconductor device modeling; Semiconductor films; Thickness control;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.857944
Filename
857944
Link To Document