The IGBT module layout design considering the electrical and thermal performance

The EV/HEV have a large demand on the IGBT module for the electric motor drive application, and the severe requirements on electric performance, heat dissipation and environment reliability have been put forwards by the customers and the designers. The layout design has direct influence on the electric, electromagnetic interference and heat dissipation performance. The current and temperature balances of the chips in paralleling are the key points of the layout design of IGBT module, and the current differences of the chips leads to imbalance losses and temperature, which cause increasing failure of the chip with highest temperature. In this paper, the transient electric performance and heat dissipation are analyzed respectively, and an electric-thermal coupling module and analyzing method are put forward in this paper. The module not only can be applied to help the layout design, but also used for the system level analysis.