DocumentCode :
136931
Title :
A family of Quasi-Switched-Capacitor converters
Author :
Xuan Zhang ; Chengcheng Yao ; Feng Guo ; Lixing Fu ; Jin Wang
Author_Institution :
Dept. of Electr. & Comput. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2014
fDate :
Aug. 31 2014-Sept. 3 2014
Firstpage :
1
Lastpage :
6
Abstract :
This paper presents a family of Quasi-Switched-Capacitor (QSC) dc/dc converters which employs a bidirectional QSC circuit. Comparing with half-bridge and full-bridge converters, the QSC converters feature reduced voltage stress on the switches and a reduced transformer turns ratio. In addition, they also feature bidirectional power flow, galvanic isolation, soft switching, resonant operation, and multi-port capability. For demonstration, two prototypes together with their experimental results are presented, including: 1) a 1-kW bidirectional QSC auxiliary power supply utilizing SiC MOSFETs for automotive application. This prototype is also evaluated with the dual-input configuration to combine the Photovoltaic (PV) system with Energy Storage System (ESS) which can be used vehicle batteries; 2) a 90-W QSC resonant converter based on eGaN FETs for ac/dc power adapters.
Keywords :
AC-DC power convertors; DC-DC power convertors; MOSFET; automobiles; energy storage; load flow; photovoltaic power systems; transformers; ESS; MOSFET; PV system; QSC dc-dc converters; QSC resonant converter; ac-dc power adapters; automotive application; bidirectional QSC auxiliary power supply; bidirectional QSC circuit; bidirectional power flow; dual-input configuration; energy storage system; full-bridge converters; galvanic isolation; half-bridge converters; multiport capability; photovoltaic system; power 90 W; quasi-switched-capacitor converters; resonant operation; soft switching; voltage stress; Batteries; Equivalent circuits; Stress; Switches; Topology; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-4240-4
Type :
conf
DOI :
10.1109/ITEC-AP.2014.6941183
Filename :
6941183
Link To Document :
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