• DocumentCode
    1369396
  • Title

    Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

  • Author

    Cho, Jeonghyeon ; Song, Eakhwan ; Kim, Heegon ; Ahn, Seungyoung ; Pak, Jun So ; Kim, Jiseong ; Kim, Joungho

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • Volume
    53
  • Issue
    3
  • fYear
    2011
  • Firstpage
    814
  • Lastpage
    822
  • Abstract
    The mixed-mode ABCD parameters are newly introduced and developed, where the definition and the connection are carefully established to have both the advantages of the mixed-mode S-parameters and the ABCD parameters, simultaneously. In addition, closed-form equations to model symmetric and asymmetric coupled transmission lines are derived. With the derived equations, the voltage transfer functions and the eye diagram of a variety of printed circuit board (PCB)-level differential interconnects are analytically attainable, which greatly enhances their applicability for signal integrity analysis. To verify the derived equations and to validate the proposed mixed-mode ABCD parameters, a series of microstrip-type differential lines on PCB test vehicles were fabricated and tested. The effectiveness of the proposed mixed-mode ABCD parameters was successfully confirmed through the comparison studies, in particular for the case of mode-conversion occurrence at the differential lines.
  • Keywords
    S-parameters; microstrip lines; printed circuit testing; printed circuits; transmission lines; PCB test vehicles; PCB-level differential interconnects; asymmetric coupled transmission lines; closed-form equations; derived equations; microstrip-type differential lines; mixed-mode ABCD parameters; mixed-mode S-parameters; printed circuit board-level differential interconnects; signal integrity analysis; voltage transfer functions; Equations; Impedance; Mathematical model; Power transmission lines; Scattering parameters; Transfer functions; Transmission line matrix methods; Differential interconnect; eye diagram; mixed-mode ABCD parameters; printed circuit board (PCB); signal integrity; transfer function;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2010.2064319
  • Filename
    5620968