Title :
A rational formulation of thermal circuit models for electrothermal simulation. II. Model reduction techniques [power electronic systems]
Author :
Hsu, Jia Tzer ; Vu-Quoc, Loc
Author_Institution :
Dept. of Aerosp. Eng., Mech. & Eng. Sci., Florida Univ., Gainesville, FL, USA
fDate :
9/1/1996 12:00:00 AM
Abstract :
For pt. I see ibid., vol. 43, no. 9, p. 721-32 (1996). To increase the efficiency of the electrothermal simulation of power electronic circuits and devices, model reduction techniques are applied to develop reduced thermal circuit models of Si chips, thermal packages, and heat sinks. Both the Modal Superposition method and a Component Mode Synthesis method are presented together with a model error estimation and a Ritz vector method. An alternative method for substructuring is also included. The reduced thermal circuit models are verified and implemented in the SABER circuit simulator. The electrothermal model of a full-bridge converter is simulated employing the proposed approach, and the results discussed
Keywords :
circuit analysis computing; equivalent circuits; error analysis; heat sinks; packaging; power electronics; reduced order systems; thermal analysis; Ritz vector method; SABER circuit simulator; Si; Si chips; component mode synthesis method; electrothermal simulation; full-bridge converter; heat sinks; modal superposition method; model error estimation; model reduction techniques; power electronic circuits; power electronic devices; power electronic systems; thermal circuit models; thermal packages; Circuit simulation; Constraint theory; Eigenvalues and eigenfunctions; Electronic packaging thermal management; Electrothermal effects; Reduced order systems; Space heating; Temperature distribution; Thermal conductivity; Thermal force;
Journal_Title :
Circuits and Systems I: Fundamental Theory and Applications, IEEE Transactions on
