Title :
Silicon carbide high-power devices
Author :
Weitzel, Charles E. ; Palmour, John W. ; Carter, Calvin H., Jr. ; Moore, Karen ; Nordquist, Kevin J. ; Allen, Scott ; Thero, Christine ; Bhatnagar, Mohit
Author_Institution :
Phoenix Corp. Res. Labs., Motorola Inc., Tempe, AZ, USA
fDate :
10/1/1996 12:00:00 AM
Abstract :
In recent years, silicon carbide has received increased attention because of its potential for high-power devices. The unique material properties of SiC, high electric breakdown field, high saturated electron drift velocity, and high thermal conductivity are what give this material its tremendous potential in the power device arena. 4H-SiC Schottky barrier diodes (1400 V) with forward current densities over 700 A/cm2 at 2 V have been demonstrated. Packaged SITs have produced 57 W of output power at 500 MHz, SiC UMOSFETs (1200 V) are projected to have 15 times the current density of Si IGBTs (1200 V). Submicron gate length 4H-SiC MESFETs have achieved fmax=32 GHz, fT=14.0 GHz, and power density=2.8 W/mm @ 1.8 GHz. The performances of a wide variety of SiC devices are compared to that of similar Si and GaAs devices and to theoretically expected results
Keywords :
Schottky diodes; current density; electric breakdown; power MESFET; power MOSFET; power semiconductor devices; power semiconductor diodes; reviews; silicon compounds; static induction transistors; wide band gap semiconductors; 1200 V; 1400 V; 4H-SiC; 500 MHz to 32 GHz; 57 W; Schottky barrier diodes; SiC; SiC devices; UMOSFET; current density; high electric breakdown field; high saturated electron drift velocity; high thermal conductivity; high-power devices; packaged SIT; submicron gate length MESFET; Conducting materials; Current density; Electric breakdown; Electron mobility; Material properties; Packaging; Schottky barriers; Schottky diodes; Silicon carbide; Thermal conductivity;
Journal_Title :
Electron Devices, IEEE Transactions on