• DocumentCode
    1370062
  • Title

    Silicon carbide high-power devices

  • Author

    Weitzel, Charles E. ; Palmour, John W. ; Carter, Calvin H., Jr. ; Moore, Karen ; Nordquist, Kevin J. ; Allen, Scott ; Thero, Christine ; Bhatnagar, Mohit

  • Author_Institution
    Phoenix Corp. Res. Labs., Motorola Inc., Tempe, AZ, USA
  • Volume
    43
  • Issue
    10
  • fYear
    1996
  • fDate
    10/1/1996 12:00:00 AM
  • Firstpage
    1732
  • Lastpage
    1741
  • Abstract
    In recent years, silicon carbide has received increased attention because of its potential for high-power devices. The unique material properties of SiC, high electric breakdown field, high saturated electron drift velocity, and high thermal conductivity are what give this material its tremendous potential in the power device arena. 4H-SiC Schottky barrier diodes (1400 V) with forward current densities over 700 A/cm2 at 2 V have been demonstrated. Packaged SITs have produced 57 W of output power at 500 MHz, SiC UMOSFETs (1200 V) are projected to have 15 times the current density of Si IGBTs (1200 V). Submicron gate length 4H-SiC MESFETs have achieved fmax=32 GHz, fT=14.0 GHz, and power density=2.8 W/mm @ 1.8 GHz. The performances of a wide variety of SiC devices are compared to that of similar Si and GaAs devices and to theoretically expected results
  • Keywords
    Schottky diodes; current density; electric breakdown; power MESFET; power MOSFET; power semiconductor devices; power semiconductor diodes; reviews; silicon compounds; static induction transistors; wide band gap semiconductors; 1200 V; 1400 V; 4H-SiC; 500 MHz to 32 GHz; 57 W; Schottky barrier diodes; SiC; SiC devices; UMOSFET; current density; high electric breakdown field; high saturated electron drift velocity; high thermal conductivity; high-power devices; packaged SIT; submicron gate length MESFET; Conducting materials; Current density; Electric breakdown; Electron mobility; Material properties; Packaging; Schottky barriers; Schottky diodes; Silicon carbide; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.536819
  • Filename
    536819