Title :
A hybrid 6H-SiC temperature sensor operational from 25°C to 500°C
Author :
Casady, Jeffrey B. ; Dillard, William C. ; Johnson, R. Wayne ; Rao, U.
Author_Institution :
NASA Centre for Comput. Dev. & Adv. Electron., Auburn Univ., AL, USA
fDate :
9/1/1996 12:00:00 AM
Abstract :
6H-SiC buried-gate n-channel depletion-mode junction field-effect transistors (JFETs) were characterized from 25°C to 350°C in terms of transconductance (gm), pinchoff voltage (VP ), output resistance (ro), input resistance (Rin ), drain-to-source current at zero gate-to-source voltage (IDSS), gate-to-source reverse biased leakage current (IGSS), off-state drain-to-source current (IDSS(off) ), and noise power spectral density (SV). The 6H-SiC JFET´s were used in a hybrid temperature monitoring circuit (tested from -196°C to 500°C) fabricated at Auburn University for use in numerous industrial applications. Simulation program with integrated circuit emphasis (SPICE) simulations of the temperature monitoring circuit´s output voltage corresponded well with measured data as a function of temperature. Linear regression (LR) analysis of measured data revealed a notably sensitive (~2.3 mV/°), and an eminently linear (correlation coefficient =-0.0996...over 25°C to 500°C range) relationship between the measured output voltage and temperature. Below -50°C, the output became nonlinear, presumably from carrier freeze-out effects. To the best of our knowledge, this represents the first successful implementation of SiC active devices into a temperature sensor which demonstrated stable operation up to 500°C
Keywords :
SPICE; electric sensing devices; junction gate field effect transistors; silicon compounds; temperature measurement; temperature sensors; wide band gap semiconductors; 25 to 500 C; 6H-SiC buried-gate n-channel depletion-mode JFET; SPICE simulation; SiC; active device; carrier freeze-out; gate-to-source reverse biased leakage current; hybrid temperature sensor; industrial applications; input resistance; junction field-effect transistor; linear regression analysis; noise power spectral density; off-state drain-to-source current; output resistance; pinchoff voltage; temperature monitoring circuit; transconductance; zero gate-to-source voltage drain-to-source current; Circuit testing; Decision support systems; FETs; Integrated circuit measurements; JFETs; SPICE; Temperature measurement; Temperature sensors; Transconductance; Voltage;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on