DocumentCode
1370246
Title
Evaporation cooling of high power electronic devices
Author
Dulnev, Gennady N. ; Korablyev, Vladimir A. ; Sharkov, Alexander V.
Author_Institution
Inst. of Precision Mech. & Opt., St. Petersburg, Russia
Volume
19
Issue
3
fYear
1996
fDate
9/1/1996 12:00:00 AM
Firstpage
431
Lastpage
434
Abstract
This paper presents the problems of choosing heat transfer devices with good heat dissipating ability under boiling, as well as their utilization for cooling power semiconductor devices, for example, diodes, transistors, and thyristors. The experimental investigation of heat transfer crisis in cooling channels under the forced movement of dielectric coolant was carried out
Keywords
boiling; cooling; evaporation; power semiconductor devices; boiling; dielectric coolant; diode; evaporation cooling; heat dissipation; heat transfer; high power electronic device; semiconductor device; thyristor; transistor; Coolants; Dielectrics; Electronic equipment; Electronics cooling; Heat transfer; Power electronics; Power semiconductor devices; Semiconductor diodes; Temperature dependence; Thyristors;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.536845
Filename
536845
Link To Document