• DocumentCode
    137065
  • Title

    Aging diagnosis of silicone rubber composite insulator based on conduction current test

  • Author

    Yonggang Li ; Chengcai Huang

  • Author_Institution
    North China Electr. Power Univ., Baoding, China
  • fYear
    2014
  • fDate
    Aug. 31 2014-Sept. 3 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper presents a new criterion on aging diagnosis of silicone rubber composite insulator. Taking being operated composite insulators as the object, the electrical degradation threshold was obtained by the conduction current test, then the hydrophobic of samples was obtained by static contact angle measurement and the surface micro of samples was analyzed by surface electron microstructure (SEM). Preliminary tests indicates that the electrical degradation threshold of samples changing from 5 to 10 kV/mm with different aging degree, the more severe the degree of aging of the sample, the deeper its trap level, the lower the electrical degradation threshold, the greater the conduction current value. Research shows that electrical degradation threshold obtained by conduction current test of silicone rubber composite insulators can basically reflect material´s aging degree, electrical degradation threshold may become the new criterion for diagnosing aging condition of silicone rubber composite insulators.
  • Keywords
    ageing; composite insulators; hydrophobicity; insulator testing; silicone rubber insulators; SEM; aging diagnosis; conduction current test; electrical degradation threshold; insulator hydrophobicity; silicone rubber composite insulator; static contact angle measurement; surface electron microstructure; Aging; Degradation; Rubber; Silicon; Space charge; aging diagnosis; composite insulator; silicone rubber; the electrical degradation threshold;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-4240-4
  • Type

    conf

  • DOI
    10.1109/ITEC-AP.2014.6941270
  • Filename
    6941270