DocumentCode
1370872
Title
Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems
Author
Becker, Wiren D. ; Eckhardt, Jim ; Frech, Roland W. ; Katopis, George A. ; Klink, Erich ; McAllister, Michael F. ; McNamara, Timothy G. ; Muench, Paul ; Richter, Stephen R. ; Smith, Howard H.
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
Volume
21
Issue
2
fYear
1998
fDate
5/1/1998 12:00:00 AM
Firstpage
157
Lastpage
163
Abstract
Complementary metal-oxide-semiconductor (CMOS) microprocessors operating in the hundreds of megahertz create significant current deltas due to the variation in switching activity front clock cycle to clock cycle. In addition to the high-frequency voltage variations more commonly discussed, a lower frequency noise component is also produced that lasts from 50-200 ns which we refer to as mid-frequency noise. In this paper, we discuss the design of IBM´s CMOS S/390 computer for control of mid-frequency noise. This machine has a 10-way multiprocessor on a 127 mm by 127 mm multichip module (MCM) on a FR4 board. The chips on the MCM cause a current step of tens of Amps in a few cycles that can be sustained for many cycles. The power distribution and decoupling capacitors must supply that current without disturbing the voltage level at the circuits. The design of the system power distribution and modeling and verification of mid-frequency noise in this system is presented
Keywords
CMOS digital integrated circuits; VLSI; capacitors; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; microprocessor chips; multichip modules; 50 to 100 ns; CMOS microprocessors; computer systems; current deltas; decoupling capacitors; mid-frequency simultaneous switching noise; multichip module; power distribution; switching activity; system power distribution; ten-way multiprocessor; Capacitors; Circuits; Clocks; Current supplies; Frequency; Microprocessors; Multichip modules; Power distribution; Semiconductor device modeling; Voltage;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.673703
Filename
673703
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