• DocumentCode
    1370872
  • Title

    Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems

  • Author

    Becker, Wiren D. ; Eckhardt, Jim ; Frech, Roland W. ; Katopis, George A. ; Klink, Erich ; McAllister, Michael F. ; McNamara, Timothy G. ; Muench, Paul ; Richter, Stephen R. ; Smith, Howard H.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • Volume
    21
  • Issue
    2
  • fYear
    1998
  • fDate
    5/1/1998 12:00:00 AM
  • Firstpage
    157
  • Lastpage
    163
  • Abstract
    Complementary metal-oxide-semiconductor (CMOS) microprocessors operating in the hundreds of megahertz create significant current deltas due to the variation in switching activity front clock cycle to clock cycle. In addition to the high-frequency voltage variations more commonly discussed, a lower frequency noise component is also produced that lasts from 50-200 ns which we refer to as mid-frequency noise. In this paper, we discuss the design of IBM´s CMOS S/390 computer for control of mid-frequency noise. This machine has a 10-way multiprocessor on a 127 mm by 127 mm multichip module (MCM) on a FR4 board. The chips on the MCM cause a current step of tens of Amps in a few cycles that can be sustained for many cycles. The power distribution and decoupling capacitors must supply that current without disturbing the voltage level at the circuits. The design of the system power distribution and modeling and verification of mid-frequency noise in this system is presented
  • Keywords
    CMOS digital integrated circuits; VLSI; capacitors; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; microprocessor chips; multichip modules; 50 to 100 ns; CMOS microprocessors; computer systems; current deltas; decoupling capacitors; mid-frequency simultaneous switching noise; multichip module; power distribution; switching activity; system power distribution; ten-way multiprocessor; Capacitors; Circuits; Clocks; Current supplies; Frequency; Microprocessors; Multichip modules; Power distribution; Semiconductor device modeling; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.673703
  • Filename
    673703