DocumentCode :
1371007
Title :
Post-Placement Power Optimization With Multi-Bit Flip-Flops
Author :
Lin, Mark Po-Hung ; Hsu, Chih-Cheng ; Chang, Yao-Tsung
Author_Institution :
Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
Volume :
30
Issue :
12
fYear :
2011
Firstpage :
1870
Lastpage :
1882
Abstract :
Optimization for power is always one of the most important design objectives in modern nanometer integrated circuit design. Recent studies have shown the effectiveness of applying multi-bit flip-flops to save the power consumption of the clock network. This paper presents: 1) a novel design methodology of applying multi-bit flip-flops at the post-placement stage, which can be seamlessly integrated in modern design flow; 2) a new problem formulation for post-placement optimization with multi-bit flip-flops; 3) flip-flop clustering and placement algorithms to simultaneously minimize flip-flop power consumption and interconnecting wirelength; and 4) a progressive window-based optimization technique to reduce placement deviation and improve runtime efficiency of our algorithms. Experimental results show that our algorithms are very effective in reducing not only flip-flop power consumption but also clock tree and signal net wirelength. Consequently, the power consumption of the clock network is minimized.
Keywords :
clocks; flip-flops; integrated circuit design; integrated circuit interconnections; optimisation; clock tree network; flip-flop clustering; interconnecting wirelength; multibit flip-flop; nanometer integrated circuit design; placement deviation reduction; post-placement power optimization; power consumption; progressive window-based optimization technique; signal net wirelength; Flip-flops; Integrated circuit synthesis; Low power electronics; Nanostructure devices; Optimization; Multi-bit flip-flop; physical design; post-layout resynthesis; power optimization; synthesis for low power;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2011.2165716
Filename :
6071086
Link To Document :
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