DocumentCode
1371079
Title
Evaluation of packaging strays in discrete semiconductor devices
Author
Rodriguez-Tellez, V.J. ; Baloch, A.K.
Author_Institution
Dept. of Electr. Eng., Bradford Univ., UK
Volume
138
Issue
4
fYear
1991
fDate
8/1/1991 12:00:00 AM
Firstpage
501
Lastpage
509
Abstract
The stray components introduced by device packaging are considered. It is necessary to be able to accurately describe these effects to simulate complete devices. The measurement of the parameters of the package model is considered. A procedure for evaluating the stray components is introduced and results presented. The development of a new probe is also presented, which enables discrete chip devices to be measured directly over a broad frequency band
Keywords
packaging; semiconductor devices; broad frequency band; device packaging; discrete chip devices; discrete semiconductor devices; package model; packaging strays;
fLanguage
English
Journal_Title
Circuits, Devices and Systems, IEE Proceedings G
Publisher
iet
ISSN
0956-3768
Type
jour
Filename
86049
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