• DocumentCode
    1371374
  • Title

    Wafer packing for full mask exposure fabrication

  • Author

    Du, Ding-Zhu ; Lim, Andrew

  • Author_Institution
    Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN
  • Volume
    34
  • Issue
    7
  • fYear
    1998
  • fDate
    4/2/1998 12:00:00 AM
  • Firstpage
    659
  • Lastpage
    660
  • Abstract
    The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective
  • Keywords
    integrated circuit manufacture; masks; semiconductor process modelling; IC manufacture; full mask exposure fabrication; heuristic; process-dependent variables; test data; wafer packing;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19980482
  • Filename
    673783
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1371374