Title :
Wafer packing for full mask exposure fabrication
Author :
Du, Ding-Zhu ; Lim, Andrew
Author_Institution :
Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN
fDate :
4/2/1998 12:00:00 AM
Abstract :
The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective
Keywords :
integrated circuit manufacture; masks; semiconductor process modelling; IC manufacture; full mask exposure fabrication; heuristic; process-dependent variables; test data; wafer packing;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19980482
