DocumentCode
1372100
Title
Foreword contributions from the eighth topical meeting on electrical performance of electronic packaging
Author
Deutsch, A. ; Swaminathan, Madhavan
Author_Institution
IBM T. J. Watson Research Center
Volume
23
Issue
3
fYear
2000
Firstpage
338
Lastpage
339
Keywords
Capacitors; Clocks; Electronics packaging; Power distribution; Power system interconnection; Power system modeling; Propagation losses; Signal analysis; USA Councils; Wiring;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2000.861545
Filename
861545
Link To Document