Title :
Foreword contributions from the eighth topical meeting on electrical performance of electronic packaging
Author :
Deutsch, A. ; Swaminathan, Madhavan
Author_Institution :
IBM T. J. Watson Research Center
Keywords :
Capacitors; Clocks; Electronics packaging; Power distribution; Power system interconnection; Power system modeling; Propagation losses; Signal analysis; USA Councils; Wiring;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2000.861545
