DocumentCode
1372132
Title
Broadband modeling and measurement of the signal behavior in S/390 MCM packages
Author
Ktata, Faïez M. ; Arz, Uwe ; Grabinski, Hartmut
Author_Institution
Lab. of Inf. Technol., Hannover Univ., Germany
Volume
23
Issue
3
fYear
2000
fDate
8/1/2000 12:00:00 AM
Firstpage
375
Lastpage
381
Abstract
In this work, we investigate the electrical performance of critical signal paths in IBM´s S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz
Keywords
S-parameters; SPICE; equivalent circuits; finite element analysis; multichip modules; 3 GHz; IBM S/390 MCM package; S-parameters measurement; SPICE circuit simulation; broadband signal; electrical characteristics; equivalent circuit; finite element method; lumped RLC model; parameter extraction; two-port network analyzer; Ceramics; Circuit simulation; Conducting materials; Geometry; Integrated circuit interconnections; Packaging; Semiconductor device modeling; Thick films; Transistors; Wiring;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.861550
Filename
861550
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