Title :
Hardware technology for the Hitachi MP5800 series (HDS Skyline Series)
Author :
Kobayashi, Fumiyuki ; Watanabe, Yutaka ; Kasai, Kenichi ; Koide, Kazuo ; Nakanishi, Keiichiro ; Sato, Ryohei
Author_Institution :
Enterprise Server Div., Hitachi Ltd., Kanagawa, Japan
fDate :
8/1/2000 12:00:00 AM
Abstract :
The Hitachi MP5800 series (HDS Skyline SeriesTM) has been developed as the top-of-the-line member of the M Parallel Series general computer family. Its highlights include the highest processor performance, dramatically reduced installation requirements (footprint and power consumption), and enhanced reliability and availability. To achieve these goals, innovative technologies have been developed: semiconductor technology called Advanced CMOS-ECL (ACE), which combines high speed emitter coupled logic (ECL) and high density complementary metal oxide semiconductor (CMOS) circuits, one-module processor, which employs a glass ceramic substrate, a high density packaging scheme whereby up to four instruction processors (IPs) are mounted on a single printed wiring board, a cooling technology for large scale integration (LSI) chips with a power consumption as high as 140 W/chip, and a compact high-efficiency power supply system
Keywords :
BiCMOS digital integrated circuits; computer installation; cooling; emitter-coupled logic; general purpose computers; large scale integration; packaging; parallel machines; reliability; Advanced CMOS-ECL; HDS Skyline Series; Hitachi MP5800 series; LSI chips; M Parallel Series general computer family; availability; cooling technology; glass ceramic substrate; hardware technology; high density complementary metal oxide semiconductor; high density packaging scheme; high speed emitter coupled logic; installation requirements; instruction processors; power consumption; printed wiring board; processor performance; reliability; Availability; CMOS logic circuits; CMOS process; CMOS technology; Concurrent computing; Coupling circuits; Energy consumption; Glass; Hardware; Large scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.861567