Development of measurement system for die-pad behavior in IC encapsulation process using Hall elements

This paper describes a new method of measuring the die-pad behavior in the integrated circuit (IC) encapsulation process using Hall elements and a permanent magnet. The method enables us to measure the die-pad behavior along both the height and rotational directions during the melt filling and curing process. The measurement results were compared with that of the direct observation of the die-pad behavior using a high speed video camera and the static observation of the cross section of molding products, and the results obtained by Hall elements showed more or less good agreement with those of the other two methods. The experiments were carried out under three kinds of transfer times. The results showed that the die-pad moved more when the transfer time was longer, which suggested that the transfer time affected the die-pad behavior