Title :
Underfill adhesion to BCB (CycloteneTM) bumping and redistribution dielectrics
Author :
Garrou, Philip ; Scheck, Daniel ; Im, Jang-Hi ; Hetzner, J. ; Meyers, Greg ; Hawn, David ; Wu, Jiali ; Vincent, Michael B. ; Wong, C.P.
Author_Institution :
Dow Chem, Research Triangle Park, NC, USA
fDate :
8/1/2000 12:00:00 AM
Abstract :
The adhesion of several commercial underfills (Dexter Hysol FP4511, FP4527, and CNB775-34) to BCB (CYCLOTENE 4022, 4024) has been studied through die shear testing and subsequent failure analysis. Die shear values range between 69-30 MPa. Failure analysis by optical microscopy, profilometry and XPS spectroscopy indicates mixed mode failure at various interfaces. From the die shear data collected before and after 24 h water boil for Cyclotene 4022 and 4024 (with AP3000 adhesion promoter) and underfillers FP 4511 and 4527 we find the die shear strength decreases an average of 11% for the four comparisons. Adhesion promoters based on vinyltriacetoxysilane or 3-amino-propyltriethoxysilane show equivalent die shear performance. Substrate surface cleaning based on UV ozone treatment reveals oxidation of the BCB surface which by SIMS analysis remains <0.1 μm deep after 10 min of treatment
Keywords :
adhesion; dielectric thin films; encapsulation; failure analysis; polymer films; surface cleaning; BCB; Cyclotene; Dexter Hysol underfill; SIMS; UV ozone treatment; XPS; adhesion; adhesion promoter; bumping; die shear strength; failure analysis; optical microscopy; oxidation; profilometry; redistribution dielectric; substrate surface cleaning; Adhesives; Chemicals; Dielectric substrates; Failure analysis; Mechanical factors; Optical microscopy; Spectroscopy; Surface cleaning; Surface treatment; Testing;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.861575
