Title :
A DDR3/4 memory link TX supporting 24–40 Ω, 0.8–1.6 V, 0.8–5.0 Gb/s with slew rate control and thin oxide output stages in 22-nm CMOS SOI
Author :
Kossel, Marcel ; Menolfi, Christian ; Toifl, Thomas ; Francese, Pier Andrea ; Brandli, Matthias ; Morf, Thomas ; Kull, Lukas ; Andersen, Toke Meyer ; Yueksel, Hazar
Author_Institution :
IBM Res. - Zurich, Rüschlikon, Switzerland
Abstract :
A transmitter for data (DQ) lines in a DDR3/4 memory link is presented. The transmitter supports a drive impedance range of 24-40 Ω, operates from a 0.8-1.6 V supply range, and runs between 0.8 and 5.0 Gb/s. The DDR TX includes a clock-feathering-based slew rate control with duty cycle adjustment and uses thin oxide output stages for power saving. The power supply for the thin oxide pull-up protection is provided by an on-chip voltage regulator. Also FFE with 1 postcursor tap and max. 9.5 dB de-emphasis at 40 Ω is included. Results measured with typical DDR settings such as 30 Ω drive impedance and 1.35 V supply show a 1.2-5.8 V/ns slew rate range into a 50 Ω termination, an energy efficiency at 2133 Mb/s of 4.4 pJ/bit and TJ (BER 10-12) of 26 ps. The transmitter is fabricated in 22-nm CMOS SOI and has a size of 132 × 83 μm2.
Keywords :
CMOS memory circuits; DRAM chips; clocks; driver circuits; electric impedance; power aware computing; silicon-on-insulator; transmitters; voltage regulators; CMOS SOI; DDR3/4 memory link TX; FFE; bit rate 0.8 Gbit/s to 5.0 Gbit/s; clock feathering-based slew rate control; data lines; drive impedance range; duty cycle adjustment; energy efficiency; on-chip voltage regulator; postcursor tap; power saving; power supply; resistance 24 ohm to 40 ohm; size 22 nm; thin oxide output stages; thin oxide pull-up protection; transmitter; voltage 0.8 V to 1.6 V; Clocks; Delay lines; Delays; Field effect transistors; Impedance; Multiplexing; Transmitters;
Conference_Titel :
European Solid State Circuits Conference (ESSCIRC), ESSCIRC 2014 - 40th
Conference_Location :
Venice Lido
Print_ISBN :
978-1-4799-5694-4
DOI :
10.1109/ESSCIRC.2014.6942040