DocumentCode :
1373287
Title :
Power SiC DMOSFET Model Accounting for Nonuniform Current Distribution in JFET Region
Author :
Fu, Ruiyun ; Grekov, Alexander ; Hudgins, Jerry ; Mantooth, Alan ; Santi, Enrico
Author_Institution :
Univ. of South Carolina, Columbia, SC, USA
Volume :
48
Issue :
1
fYear :
2012
Firstpage :
181
Lastpage :
190
Abstract :
The main goal of this paper is development of a new circuit-based silicon carbide (SiC) DMOSFET model which physically represents the mechanism of current saturation in power SiC DMOSFET. Finite-element simulations show that current saturation for a typical device geometry is due to 2-D carrier distribution effects in the JFET region caused by current spreading from the channel to the JFET region. For high drain-source voltages, most of the voltage drop occurs in the current spreading region located in the JFET region close to the channel. A new model is proposed that represents the nonuniform current distribution in the JFET region using a nonlinear voltage source and a resistance network. Advantages of the proposed model are that a single set of equations describes operation in both the linear and saturation regions, and that it provides a more physical description of MOSFET operation.
Keywords :
electric potential; finite element analysis; junction gate field effect transistors; power MOSFET; semiconductor device models; silicon compounds; 2D carrier distribution effect; JFET region; SiC; circuit-based silicon carbide DMOSFET model; current saturation; device geometry; drain-source voltages; finite element simulation; nonlinear voltage source; nonuniform current distribution; power DMOSFET model; resistance network; voltage drop; Finite element methods; Integrated circuit modeling; JFETs; Logic gates; MOSFET circuits; Mathematical model; Silicon carbide; Current spreading region; DMOSFET; nonuniform current distribution; silicon carbide (SiC);
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2011.2175678
Filename :
6075251
Link To Document :
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