Title :
Impact of temperature on substrate coupling in low-doped substrate
Author :
Quaresma, H.J. ; dos Santos, P.M. ; Serra, A.C.
Author_Institution :
Inst. de Telecomun., Inst. Super. Tecnico, Lisbon, Portugal
Abstract :
The effect of temperature on substrate coupling is reported for the first time. Modelling and experimental results are presented, showing a significant linear dependence of the substrate resistance with temperature in the range between 257 and 418 K. The observed decrease in substrate resistance at lower temperatures implies that the substrate noise coupling could be seriously underestimated if the temperature effect is not taken into account. These results reveal the importance of including the effects of temperature on the substrate resistance models for the correct modelling of the substrate noise coupling.
Keywords :
monolithic integrated circuits; substrates; integrated circuits; low-doped substrate; monolithic integration; substrate noise coupling; substrate resistance models; temperature effect;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2011.2402
