DocumentCode
1374561
Title
Generic Radiation Hardened Photodiode Layouts for Deep Submicron CMOS Image Sensor Processes
Author
Goiffon, V. ; Cervantes, P. ; Virmontois, C. ; Corbière, F. ; Magnan, P. ; Estribeau, M.
Author_Institution
ISAE, Univ. de Toulouse, Toulouse, France
Volume
58
Issue
6
fYear
2011
Firstpage
3076
Lastpage
3084
Abstract
Selected radiation hardened photodiode layouts, manufactured in a deep submicron CMOS Image Sensor technology, are irradiated by 60Co γ-rays up to 2.2 Mrad (SiO2) and studied in order to identify the most efficient structures and the guidelines (recess distance, bias voltage) to follow to make them work efficiently in such technology. To do so, both photodiode arrays and active pixel sensors are used. After 2.2 Mrad (SiO2), the studied sensors are fully functional and most of the radiation hardened photodiodes exhibit radiation induced dark current values more than one order of magnitude lower than the standard photodiode.
Keywords
CMOS image sensors; cobalt; dark conductivity; gamma-ray effects; photodiodes; radiation hardening; 60Co; 60Co γ-rays; active pixel sensors; deep submicron CMOS image sensor processes; generic radiation hardened photodiode layouts; guidelines; photodiode arrays; radiation induced dark current values; standard photodiode; Active pixel sensors; CMOS image sensors; Dark current; Layout; Logic gates; Photodiodes; Radiation hardening; Active pixel sensors (APS); CMOS image sensors (CIS); dark current; deep submicron (DSM) processes; interface states; ionizing radiation; monolithic active pixel sensor (MAPS); radiation hardening by design (RHBD); shallow trench isolation (STI); total ionizing dose (TID); trapped charge;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2011.2171502
Filename
6078446
Link To Document