DocumentCode :
1374561
Title :
Generic Radiation Hardened Photodiode Layouts for Deep Submicron CMOS Image Sensor Processes
Author :
Goiffon, V. ; Cervantes, P. ; Virmontois, C. ; Corbière, F. ; Magnan, P. ; Estribeau, M.
Author_Institution :
ISAE, Univ. de Toulouse, Toulouse, France
Volume :
58
Issue :
6
fYear :
2011
Firstpage :
3076
Lastpage :
3084
Abstract :
Selected radiation hardened photodiode layouts, manufactured in a deep submicron CMOS Image Sensor technology, are irradiated by 60Co γ-rays up to 2.2 Mrad (SiO2) and studied in order to identify the most efficient structures and the guidelines (recess distance, bias voltage) to follow to make them work efficiently in such technology. To do so, both photodiode arrays and active pixel sensors are used. After 2.2 Mrad (SiO2), the studied sensors are fully functional and most of the radiation hardened photodiodes exhibit radiation induced dark current values more than one order of magnitude lower than the standard photodiode.
Keywords :
CMOS image sensors; cobalt; dark conductivity; gamma-ray effects; photodiodes; radiation hardening; 60Co; 60Co γ-rays; active pixel sensors; deep submicron CMOS image sensor processes; generic radiation hardened photodiode layouts; guidelines; photodiode arrays; radiation induced dark current values; standard photodiode; Active pixel sensors; CMOS image sensors; Dark current; Layout; Logic gates; Photodiodes; Radiation hardening; Active pixel sensors (APS); CMOS image sensors (CIS); dark current; deep submicron (DSM) processes; interface states; ionizing radiation; monolithic active pixel sensor (MAPS); radiation hardening by design (RHBD); shallow trench isolation (STI); total ionizing dose (TID); trapped charge;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2011.2171502
Filename :
6078446
Link To Document :
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