• DocumentCode
    1374561
  • Title

    Generic Radiation Hardened Photodiode Layouts for Deep Submicron CMOS Image Sensor Processes

  • Author

    Goiffon, V. ; Cervantes, P. ; Virmontois, C. ; Corbière, F. ; Magnan, P. ; Estribeau, M.

  • Author_Institution
    ISAE, Univ. de Toulouse, Toulouse, France
  • Volume
    58
  • Issue
    6
  • fYear
    2011
  • Firstpage
    3076
  • Lastpage
    3084
  • Abstract
    Selected radiation hardened photodiode layouts, manufactured in a deep submicron CMOS Image Sensor technology, are irradiated by 60Co γ-rays up to 2.2 Mrad (SiO2) and studied in order to identify the most efficient structures and the guidelines (recess distance, bias voltage) to follow to make them work efficiently in such technology. To do so, both photodiode arrays and active pixel sensors are used. After 2.2 Mrad (SiO2), the studied sensors are fully functional and most of the radiation hardened photodiodes exhibit radiation induced dark current values more than one order of magnitude lower than the standard photodiode.
  • Keywords
    CMOS image sensors; cobalt; dark conductivity; gamma-ray effects; photodiodes; radiation hardening; 60Co; 60Co γ-rays; active pixel sensors; deep submicron CMOS image sensor processes; generic radiation hardened photodiode layouts; guidelines; photodiode arrays; radiation induced dark current values; standard photodiode; Active pixel sensors; CMOS image sensors; Dark current; Layout; Logic gates; Photodiodes; Radiation hardening; Active pixel sensors (APS); CMOS image sensors (CIS); dark current; deep submicron (DSM) processes; interface states; ionizing radiation; monolithic active pixel sensor (MAPS); radiation hardening by design (RHBD); shallow trench isolation (STI); total ionizing dose (TID); trapped charge;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2011.2171502
  • Filename
    6078446