DocumentCode :
137466
Title :
Quo vadis third party payment after deregulation of Bank Act? A qualitative observation on the trend of e-commerce patents in Taiwan
Author :
Sung-Min Lin ; Liu, Anne Yen-Ching
Author_Institution :
Inst. of Technol. Manage., Nat. Chung-Hsing Univ., Taichung, Taiwan
fYear :
2014
fDate :
23-25 Sept. 2014
Firstpage :
349
Lastpage :
354
Abstract :
The deregulation of the Bank Act on the third party payment in Taiwan caught the attention of many potential investors and technological start-up companies that are eager to lay out its business plans and technological measures. Apparently, the evidence on the increasing number of the patent applications related to e-commerce strongly supports the cause, and the big picture of the booming market with various opportunities on service industry is foreseeable. This research carries out a longitudinal analysis in different category of electronic/telecommunication industry, e-commerce, foreign applicants, and non-practice entity plus interviewing 5 selective professionals in relevant fields for the support of explanations on the findings. Furthermore, this research correlates the existing use of the patent system as the signifier to describe the dynamic changes in the potential market, and draw the linkage of the industrial dynamics between the third party payment service available and the applications possible.
Keywords :
bank data processing; electronic commerce; electronics industry; outsourcing; patents; service industries; telecommunication industry; Bank Act deregulation; Quo Vadis third party payment; Taiwan; business plans; e-commerce; electronic industry; foreign applicants; longitudinal analysis; nonpractice entity; patent system; service industry; technological measures; technological start-up companies; telecommunication industry; Business; Communications technology; Consumer electronics; Electric potential; Finance; Forecasting; Industries; E-Commerce; International Patent Classification; Patents; Third Party Payment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Management of Innovation and Technology (ICMIT), 2014 IEEE International Conference on
Conference_Location :
Singapore
Type :
conf
DOI :
10.1109/ICMIT.2014.6942451
Filename :
6942451
Link To Document :
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