DocumentCode
137466
Title
Quo vadis third party payment after deregulation of Bank Act? A qualitative observation on the trend of e-commerce patents in Taiwan
Author
Sung-Min Lin ; Liu, Anne Yen-Ching
Author_Institution
Inst. of Technol. Manage., Nat. Chung-Hsing Univ., Taichung, Taiwan
fYear
2014
fDate
23-25 Sept. 2014
Firstpage
349
Lastpage
354
Abstract
The deregulation of the Bank Act on the third party payment in Taiwan caught the attention of many potential investors and technological start-up companies that are eager to lay out its business plans and technological measures. Apparently, the evidence on the increasing number of the patent applications related to e-commerce strongly supports the cause, and the big picture of the booming market with various opportunities on service industry is foreseeable. This research carries out a longitudinal analysis in different category of electronic/telecommunication industry, e-commerce, foreign applicants, and non-practice entity plus interviewing 5 selective professionals in relevant fields for the support of explanations on the findings. Furthermore, this research correlates the existing use of the patent system as the signifier to describe the dynamic changes in the potential market, and draw the linkage of the industrial dynamics between the third party payment service available and the applications possible.
Keywords
bank data processing; electronic commerce; electronics industry; outsourcing; patents; service industries; telecommunication industry; Bank Act deregulation; Quo Vadis third party payment; Taiwan; business plans; e-commerce; electronic industry; foreign applicants; longitudinal analysis; nonpractice entity; patent system; service industry; technological measures; technological start-up companies; telecommunication industry; Business; Communications technology; Consumer electronics; Electric potential; Finance; Forecasting; Industries; E-Commerce; International Patent Classification; Patents; Third Party Payment;
fLanguage
English
Publisher
ieee
Conference_Titel
Management of Innovation and Technology (ICMIT), 2014 IEEE International Conference on
Conference_Location
Singapore
Type
conf
DOI
10.1109/ICMIT.2014.6942451
Filename
6942451
Link To Document