Title :
HBT IC process with copper substrate
Author :
Guthrie, J. ; Mensa, D. ; Agarwal, B. ; Lee, Q. ; Pullela, R. ; Rodwell, M.J.W.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fDate :
3/5/1998 12:00:00 AM
Abstract :
The authors have demonstrated a copper/polymer substrate HBT integrated circuit technology which offers a low loss microstrip transmission line environment, continuous back-side ground planes, and enhanced thermal performance
Keywords :
bipolar integrated circuits; copper; heterojunction bipolar transistors; integrated circuit technology; microstrip circuits; microwave integrated circuits; substrates; Cu; HBT integrated circuit technology; back-side ground plane; copper/polymer substrate; microstrip transmission line; thermal performance;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19980372
