A novel micromachining technique for the formation of extrusions

Author

Frankovic, Richard ; Snider, Gregory L. ; Bernstein, Gary H.

Author_Institution

Dept. of Electr. Eng., Notre Dame Univ., IN, USA

Volume

18

Issue

4

fYear

1997

fDate

4/1/1997 12:00:00 AM

Firstpage

135

Lastpage

137

Abstract

A novel micro-extrusion process (MEP) has been developed for micromachining applications. Extrusions on the micrometer scale were realized using the compressive stresses resulting from electromigration-induced mass transport in planarized conductors. Electromigration produced compressive stresses at the anodes of passivated metallic interconnects that exceeded the plastic deformation stress, and allowed extrusions to form through simple die patterns etched through the passivation at the anode ends of edge-displacement conductor segments.

Keywords

aluminium; electromigration; extrusion; metallisation; micromachining; micromechanical devices; passivation; plastic deformation; stress effects; Al; compressive stresses; edge-displacement conductor segments; electromigration-induced mass transport; extrusions formation; micro-extrusion process; micromachining technique; micrometer scale; passivated metallic interconnects; planarized conductors; plastic deformation stress; Anodes; Billets; Compressive stress; Conductors; Electromigration; Large-scale systems; Micromachining; Micromechanical devices; Passivation; Tin;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/55.563307

Filename

563307