• DocumentCode
    1376442
  • Title

    Optimization of Phase Change Material Heat Sinks for Low Duty Cycle High Peak Load Power Supplies

  • Author

    Stupar, Andrija ; Drofenik, Uwe ; Kolar, Johann W.

  • Author_Institution
    Power Electron. Syst. Lab., Swiss Fed. Inst. of Technol. Zurich, Zürich, Switzerland
  • Volume
    2
  • Issue
    1
  • fYear
    2012
  • Firstpage
    102
  • Lastpage
    115
  • Abstract
    A power electronic device´s lifetime depends on its maximum operating temperature and the temperature swings it is subjected to. Heat sinks employing phase change materials (PCMs) can be employed to achieve a temperature reduction, but only for a limited duration. This makes such heat sinks appropriate for use in applications with high peak loads but with low duty cycles. The heat sink is modeled using the thermal resistors and capacitors (RCs) network approach, and an optimization procedure for designing a hybrid air-cooled heat sink containing PCM is developed, yielding a maximum possible temperature reduction for a given application. It is shown that air-cooled heat sinks employing pure PCMs are best suited for applications with pulses width lengths of several minutes with a period of several tens of minutes. In order to achieve a faster response of the PCM, the concept of PCM-metal foam is explored and modeled. Experimental data is presented which confirms the validity of the thermal RC network approach.
  • Keywords
    capacitors; heat sinks; phase change materials; power supply circuits; PCM-metal foam; capacitor; device lifetime; hybrid air-cooled heat sink; low duty cycle high peak load power supplies; maximum operating temperature; optimization; phase change material; power electronic device; temperature reduction; thermal resistor; Heat sinks; Optimization; Phase change materials; Resistance heating; Thermal resistance; Cooling; modeling; power electronics; power supplies;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2011.2168957
  • Filename
    6081913