• DocumentCode
    1376684
  • Title

    Temperature rise of solid junctions under pulse load

  • Author

    Diebold, E. J.

  • Author_Institution
    International Rectifier Corporation, El Segundo, Calif.
  • Volume
    76
  • Issue
    5
  • fYear
    1957
  • Firstpage
    593
  • Lastpage
    598
  • Abstract
    Junctions subjected to pulse currents have a temperature rise that depends on dimensions, materials, and cooling, as much as magnitude, duration, and form of the pulse. Short pulses heat only a part of the body containing the junction; longer pulses permit the heat to penetrate deeper. Short pulses of constant magnitude, or linearly increasing in time, or capacitor discharges, show only a small difference in temperature rise. Experiments conducted with capacitor discharges are easily interpreted for other pulse shapes. For larger pulses, successive approximations are useful: plane heat flow in the junction material, plane flow in the junction and in the main body, spherical diffusion in the body, and simultaneous heating of the body with external cooling. Each approximation has its range of validity, expressed as pulse durations. Approximations overlap between ranges and cover the full span from infinitely short pulses to continuous load. A complete example is discussed.
  • Keywords
    Approximation methods; Capacitors; Computers; Discharges (electric); Equations; Heating; Junctions;
  • fLanguage
    English
  • Journal_Title
    American Institute of Electrical Engineers, Part I: Communication and Electronics, Transactions of the
  • Publisher
    ieee
  • ISSN
    0097-2452
  • Type

    jour

  • DOI
    10.1109/TCE.1957.6372351
  • Filename
    6372351