• DocumentCode
    1377956
  • Title

    Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications

  • Author

    Zhang, Jing ; Ramana, Pamidighantam V. ; Chandrappan, Jayakrishnan ; Tan, CheeWei ; Chai, Yi Yoon ; Khoo, Yee Mong ; Teo, Wei Liang ; Shing, John Lau Hon ; Gomex, Philbert Oliver ; Wang, Ting ; Ramkumar, V.M.

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • Volume
    33
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    428
  • Lastpage
    432
  • Abstract
    A low-cost optical subassembly design for large core fiber transceiver is presented. The complete transceiver module is realized by assembling the low-cost optical subassembly directly on the transceiver functional printed circuit board. -7 dBm optical power output and 6 dB extinction ratio are achieved on transmitter by the vertical self-alignment and horizontal passive alignment at the transmitter. 190 m link distance is achieved at 2.5 Gb/s and 340 m link distance is achieved at 1.25 Gb/s for the plastic optic fiber (POF) transmitter with grade index plastic optical fiber. 145 m link distance is achieved at 2.5 Gb/s for the POF receiver.
  • Keywords
    optical fibre networks; optical transmitters; transceivers; bit rate 1.25 Gbit/s; bit rate 2.5 Gbit/s; high-speed applications; large core fiber transceiver; optical subassembly; plastic optical fiber transceiver; transceiver functional printed circuit board; transceiver module; transmitter; Optical subassembly; high speed; low-cost package; plastic optical fiber;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2033810
  • Filename
    5373941