DocumentCode
1378734
Title
The Heat Is On: Graphene Applications
Author
Balandin, Alexander A.
Author_Institution
He is a professor of electrical engineering and founding chair of the Materials Science and Engineering Program at the University of California, Riverside.
Volume
5
Issue
4
fYear
2011
Firstpage
15
Lastpage
19
Abstract
It is well recognized that power consumption and heat removal in state-of-the-art integrated circuits (ICs) with the nanometer size of transistors is an urgent challenge. The electronic industry´s transition to multicore designs, where the performance increase is achieved not via the increase in the clock frequency but rather through the increase in the number of processors, helped to alleviate some of the thermal issues but has not solved the problem of the nonuniformity of heat distribution inside a computer chip.
Keywords
graphene; nanoelectronics; thermal management (packaging); computer chip; electronic industry; graphene applications; heat distribution; heat removal; power consumption; state of the art integrated circuits; Graphene; Heating; Multicore processing; Power consumption; Power distribution;
fLanguage
English
Journal_Title
Nanotechnology Magazine, IEEE
Publisher
ieee
ISSN
1932-4510
Type
jour
DOI
10.1109/MNANO.2011.943327
Filename
6083576
Link To Document