• DocumentCode
    1378734
  • Title

    The Heat Is On: Graphene Applications

  • Author

    Balandin, Alexander A.

  • Author_Institution
    He is a professor of electrical engineering and founding chair of the Materials Science and Engineering Program at the University of California, Riverside.
  • Volume
    5
  • Issue
    4
  • fYear
    2011
  • Firstpage
    15
  • Lastpage
    19
  • Abstract
    It is well recognized that power consumption and heat removal in state-of-the-art integrated circuits (ICs) with the nanometer size of transistors is an urgent challenge. The electronic industry´s transition to multicore designs, where the performance increase is achieved not via the increase in the clock frequency but rather through the increase in the number of processors, helped to alleviate some of the thermal issues but has not solved the problem of the nonuniformity of heat distribution inside a computer chip.
  • Keywords
    graphene; nanoelectronics; thermal management (packaging); computer chip; electronic industry; graphene applications; heat distribution; heat removal; power consumption; state of the art integrated circuits; Graphene; Heating; Multicore processing; Power consumption; Power distribution;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1932-4510
  • Type

    jour

  • DOI
    10.1109/MNANO.2011.943327
  • Filename
    6083576