Title :
Impact of Process Variations and Charge Sharing on the Single-Event-Upset Response of Flip-Flops
Author :
Kauppila, A.V. ; Bhuva, B.L. ; Massengill, L.W. ; Holman, W.T. ; Ball, D.R.
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN, USA
Abstract :
Process variations and charge sharing impact the single-event circuit response. This paper correlates parameter shift impact on the single-event upset (SEU) probability of flip-flop designs in advanced CMOS processes under the influence of charge sharing.
Keywords :
CMOS logic circuits; flip-flops; probability; SEU probability; advanced CMOS processes; charge sharing impact; flip-flop designs; flip-flops; parameter shift impact; process variations; single-event upset probability; single-event-upset response; CMOS technology; Flip-flops; Monte Carlo methods; Semiconductor device modeling; Sensitivity; Single event transient; Single event upset; CMOS; Charge sharing; critical charge; single-event effects; single-event transients; single-event upset (SEU);
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2011.2172691
