16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit

Author

Krishnamoorthy, Ashok V. ; Goossen, K.W. ; Chirovsky, L.M.F. ; Rozier, R.G. ; Chandramani, P. ; Hui, S.P. ; Lopata, J. ; Walker, James Alfred ; D´Asaro, L.A.

Author_Institution

Lucent Technol. Bell Labs., Holmdel, NJ, USA

Volume

12

Issue

8

fYear

2000

Firstpage

1073

Lastpage

1075

Abstract

We report the flip-chip bonding of a 16/spl times/16 array of 970-nm vertical-cavity surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circuits. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz. Individual VCSELs are capable of being modulated by the CMOS circuits at 1 Gb/s. The thermal impedance of the flip-chip bonded VCSELs is 1/spl deg/C/mW. The measured crosstalk suppression between channels is approximately 20 dB. Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated.

Keywords

CMOS integrated circuits; driver circuits; flip-chip devices; integrated optoelectronics; optical crosstalk; optical transmitters; semiconductor laser arrays; surface emitting lasers; telecommunication channels; 1 Gbit/s; 4 GHz; 970 nm; CMOS VLSI circuit; CMOS circuits; VCSEL array flip-chip bonding; flip-chip bonded VCSEL; flip-chip bonded VCSELs; measured crosstalk suppression; parallel testing; thermal impedance; Bandwidth; Bonding; Crosstalk; Driver circuits; Optical arrays; Silicon; Surface emitting lasers; Surface impedance; Vertical cavity surface emitting lasers; Very large scale integration;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.868012

Filename

868012