Title :
16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit
Author :
Krishnamoorthy, Ashok V. ; Goossen, K.W. ; Chirovsky, L.M.F. ; Rozier, R.G. ; Chandramani, P. ; Hui, S.P. ; Lopata, J. ; Walker, James Alfred ; D´Asaro, L.A.
Author_Institution :
Lucent Technol. Bell Labs., Holmdel, NJ, USA
Abstract :
We report the flip-chip bonding of a 16/spl times/16 array of 970-nm vertical-cavity surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circuits. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz. Individual VCSELs are capable of being modulated by the CMOS circuits at 1 Gb/s. The thermal impedance of the flip-chip bonded VCSELs is 1/spl deg/C/mW. The measured crosstalk suppression between channels is approximately 20 dB. Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated.
Keywords :
CMOS integrated circuits; driver circuits; flip-chip devices; integrated optoelectronics; optical crosstalk; optical transmitters; semiconductor laser arrays; surface emitting lasers; telecommunication channels; 1 Gbit/s; 4 GHz; 970 nm; CMOS VLSI circuit; CMOS circuits; VCSEL array flip-chip bonding; flip-chip bonded VCSEL; flip-chip bonded VCSELs; measured crosstalk suppression; parallel testing; thermal impedance; Bandwidth; Bonding; Crosstalk; Driver circuits; Optical arrays; Silicon; Surface emitting lasers; Surface impedance; Vertical cavity surface emitting lasers; Very large scale integration;
Journal_Title :
Photonics Technology Letters, IEEE
