DocumentCode
1380396
Title
Design and fabrication of a wideband 56- to 63-GHz monolithic power amplifier with very high power-added efficiency
Author
Tang, O. S Andy ; Liu, S. M Joseph ; Chao, Pane C. ; Kong, Wendel M T ; Hwang, K.C. ; Nichols, Kirby ; Heaton, John
Author_Institution
Lockheed Martin Sanders, Nashua, NH, USA
Volume
35
Issue
9
fYear
2000
Firstpage
1298
Lastpage
1306
Abstract
This paper describes the design, fabrication, and measurement of a wideband 60 GHz monolithic microwave integrated circuit (MMIC) power amplifier that has demonstrated via on-wafer continuous wave (CW) measurement a record 43% power-added efficiency (PAE) at an associated output power of 224 mW and 7.5 dB of power gain. At a higher drain bias of 3.5 V, the CW output power increased to 250 mW with 38.5% PAE. Additional performance improvement is expected when the MMICs are tested on-carrier with proper heat sinking. These state-of-the-art first-pass design results can be attributed to: 1) the use of a fully selective gate recess etch 0.12-/spl mu/m InP HEMT process fabricated on 2-mm-thick 3-in diameter InP substrates with slot via holes; 2) a design based on a novel on-wafer load-pull measurement technique; and 3) an accurate large-signal nonlinear model for InP HEMTs. In order to reach the low cost required for mass production, the same MMIC design was fabricated on an InP metamorphic HEMT (MHEMT) process. The MHEMT version of the MMIC demonstrated 41.5% PAE, with an associated output power of 183 mW (305 mW/mm) and 6.9 dB of power at 60 GHz when measured CW on-wafer. These InP HEMT and MHEMT results are, to our knowledge, the highest PAE and power bandwidth ever reported at V-band.
Keywords
HEMT integrated circuits; III-V semiconductors; MMIC power amplifiers; etching; field effect MIMIC; indium compounds; integrated circuit design; integrated circuit measurement; integrated circuit modeling; millimeter wave power amplifiers; wideband amplifiers; 0.12 micron; 183 mW; 224 mW; 250 mW; 3.5 V; 38.5 percent; 41.5 percent; 43 percent; 56 to 63 GHz; 7.5 dB; CW measurement; CW output power; HEMT process; IC design; IC measurement; InP; MMIC power amplifier; V-band; drain bias; fully selective gate recess etch; heat sinking; large-signal nonlinear model; metamorphic HEMT; on-wafer load-pull measurement technique; power bandwidth; power gain; power-added efficiency; slot via holes; Fabrication; HEMTs; Indium phosphide; MMICs; Microwave measurements; Power amplifiers; Power generation; Power measurement; Wideband; mHEMTs;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/4.868039
Filename
868039
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