• DocumentCode
    1380396
  • Title

    Design and fabrication of a wideband 56- to 63-GHz monolithic power amplifier with very high power-added efficiency

  • Author

    Tang, O. S Andy ; Liu, S. M Joseph ; Chao, Pane C. ; Kong, Wendel M T ; Hwang, K.C. ; Nichols, Kirby ; Heaton, John

  • Author_Institution
    Lockheed Martin Sanders, Nashua, NH, USA
  • Volume
    35
  • Issue
    9
  • fYear
    2000
  • Firstpage
    1298
  • Lastpage
    1306
  • Abstract
    This paper describes the design, fabrication, and measurement of a wideband 60 GHz monolithic microwave integrated circuit (MMIC) power amplifier that has demonstrated via on-wafer continuous wave (CW) measurement a record 43% power-added efficiency (PAE) at an associated output power of 224 mW and 7.5 dB of power gain. At a higher drain bias of 3.5 V, the CW output power increased to 250 mW with 38.5% PAE. Additional performance improvement is expected when the MMICs are tested on-carrier with proper heat sinking. These state-of-the-art first-pass design results can be attributed to: 1) the use of a fully selective gate recess etch 0.12-/spl mu/m InP HEMT process fabricated on 2-mm-thick 3-in diameter InP substrates with slot via holes; 2) a design based on a novel on-wafer load-pull measurement technique; and 3) an accurate large-signal nonlinear model for InP HEMTs. In order to reach the low cost required for mass production, the same MMIC design was fabricated on an InP metamorphic HEMT (MHEMT) process. The MHEMT version of the MMIC demonstrated 41.5% PAE, with an associated output power of 183 mW (305 mW/mm) and 6.9 dB of power at 60 GHz when measured CW on-wafer. These InP HEMT and MHEMT results are, to our knowledge, the highest PAE and power bandwidth ever reported at V-band.
  • Keywords
    HEMT integrated circuits; III-V semiconductors; MMIC power amplifiers; etching; field effect MIMIC; indium compounds; integrated circuit design; integrated circuit measurement; integrated circuit modeling; millimeter wave power amplifiers; wideband amplifiers; 0.12 micron; 183 mW; 224 mW; 250 mW; 3.5 V; 38.5 percent; 41.5 percent; 43 percent; 56 to 63 GHz; 7.5 dB; CW measurement; CW output power; HEMT process; IC design; IC measurement; InP; MMIC power amplifier; V-band; drain bias; fully selective gate recess etch; heat sinking; large-signal nonlinear model; metamorphic HEMT; on-wafer load-pull measurement technique; power bandwidth; power gain; power-added efficiency; slot via holes; Fabrication; HEMTs; Indium phosphide; MMICs; Microwave measurements; Power amplifiers; Power generation; Power measurement; Wideband; mHEMTs;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/4.868039
  • Filename
    868039