Title :
Thermo-mechanical stress investigation of integrated SAW strain sensors
Author :
Hempel, Jochen ; Anees, Sanya ; Wilde, J. ; Reindl, Leonhard
Author_Institution :
Dept. of Microsyst. Eng. IMTEK, Univ. of Freiburg, Freiburg, Germany
Abstract :
This paper presents investigations of thermo-mechanical stress generated due to the integration process of Surface Acoustic Wave (SAW) strain sensors. A 3D finite element (FE) model, based on visco-elastic material measurements, is developed for thermo-mechanical stress computation. The simulation results are compared with experiments. Therefore, SAW strain sensors were mounted, the sensor response and the sensor deformation measured. The deviation between the simulated and measured sensor chip deflection is ≤ 14.4% for the full measurement range. Simulated thermo-mechanical stresses were used for the frequency shift computation of the SAW sensor device. The calculated frequency shift and the performed deformation measurement verified the correctness of the FE model.
Keywords :
deformation; finite element analysis; strain measurement; strain sensors; stress measurement; surface acoustic wave sensors; viscoelasticity; 3D finite element model; FE model; frequency shift computation; integrated SAW strain sensor; sensor chip deflection measurement; sensor deformation measurement; sensor response measurement; surface acoustic wave strain sensor; thermomechanical stress investigation; viscoelastic material measurement; Area measurement; Semiconductor device measurement; Sensors; Strain; Stress; Surface acoustic waves; Temperature measurement;
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
DOI :
10.1109/EuroSimE.2014.6813773
