Title :
Measuring Young´s modulus of polysilicon via cantilever microbeam arrays
Author :
Kehrberg, Steven ; Dorwarth, Markus ; Gunther, Stephan ; Markisch, Steffen ; Geckeler, Carsten ; Mehner, J.
Author_Institution :
Automotive Electron., Robert Bosch GmbH, Reutlingen, Germany
Abstract :
Polysilicon is the most commonly used material for MEMS. Consequently, the Young´s modulus of polysilicon is very important for MEMS design. Measurements of this material parameter can easily be erroneous due to fabrication tolerances, like etch loss variations. The presented method separates etch loss variations from the desired measurement by using an array of micro cantilevers. The measured Young´s modulus of 164.1 GPa has a small standard deviation of 0.5 GPa, in comparison to other published data.
Keywords :
Young´s modulus; beams (structures); cantilevers; finite element analysis; mechanical properties; mechanical variables measurement; micromechanical devices; silicon; MEMS design; Young´s modulus; cantilever microbeam arrays; etch loss variations; fabrication tolerances; material parameter; polysilicon; pressure 0.5 GPa; pressure 164.1 GPa; Abstracts; Correlation; Fixtures; Lead;
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
DOI :
10.1109/EuroSimE.2014.6813778
