DocumentCode :
1380537
Title :
Low On-Resistance High-Breakdown Normally Off AlN/GaN/AlGaN DHFET on Si Substrate
Author :
Medjdoub, F. ; Derluyn, J. ; Cheng, K. ; Leys, M. ; Degroote, S. ; Marcon, D. ; Visalli, D. ; Van Hove, M. ; Germain, M. ; Borghs, G.
Author_Institution :
IMEC, Leuven, Belgium
Volume :
31
Issue :
2
fYear :
2010
Firstpage :
111
Lastpage :
113
Abstract :
Ultrathin-barrier normally off AlN/GaN/AlGaN double-heterostructure field-effect transistors using an in situ SiN cap layer have been fabricated on 100-mm Si substrates for the first time. The high 2DEG density in combination with an extremely thin barrier layer leads to enhancement-mode devices with state-of-the-art combination of specific on-resistance that is as low as 1.25 m????cm2 and breakdown voltage of 580 V at V GS = 0 V . Despite the 2-??m gate length used, the transconductance peaks above 300 mS/mm. Furthermore, pulsed measurements show that the devices are dispersion free up to high drain voltage V DS = 50 V. More than 200 devices have been characterized in order to confirm the reproducibility of the results.
Keywords :
aluminium compounds; electric breakdown; gallium compounds; high electron mobility transistors; silicon compounds; wide band gap semiconductors; AlN-GaN-AlGaN; DHFET; SiN; breakdown voltage; enhancement-mode devices; low on-resistance; size 100 mm; size 2 mum; thin barrier layer; transconductance; ultra thin barrier double-heterostructure field-effect transistors; voltage 50 V; voltage 580 V; AlN/GaN double-heterostructure field-effect transistor (DHFET); Si substrate; high breakdown voltage; low specific on-resistance; normally off;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2009.2037719
Filename :
5378574
Link To Document :
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