• DocumentCode
    138086
  • Title

    Modelling of non-stationary processes in optomechanical thermal microsensors

  • Author

    Kozlov, A.G.

  • Author_Institution
    Omsk State Univ., Omsk, Russia
  • fYear
    2014
  • fDate
    7-9 April 2014
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    An analytical method is developed to determine the frequency response of optomechanical thermal microsensors. The three types of the microsensors are considered: microsensor with the two supporting beams in adjacent corners of the plate; microsensor with the two supporting beams in opposite corners of the plate; microsensor with the four supporting beams. Taking into account the features of each type of the microsensors, in they structures, the domains of modelling are marked out. The domains are divided into the regions with homogeneous parameters. For each region the non-steady-state heat conduction equation is obtained that is solved by means of the time Fourier transform. The heat flux densities between the regions are determined using adjoint boundary conditions in the frequency domain. The analytical expression for the frequency responses of the microsensors is obtained. This method is applied to find the frequency responses, cutoff frequencies and time constants for the three types of optomechanical thermal microsensors. The dependencies of the sensitivity and the time constant on the length of the bi-material section of the beams for the microsensor with the two supporting beams in adjacent corners are obtained.
  • Keywords
    heat conduction; micro-optomechanical devices; microsensors; optical sensors; temperature sensors; adjacent plate comer; adjoint boundary condition; bimaterial section; frequency response; heat flux density; homogeneous parameter region; nonstationary process; optomechanical thermal microsensor; steady-state heat conduction equation; supporting beam; time Fourier transform; Abstracts; Analytical models; Manganese; Microsensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
  • Conference_Location
    Ghent
  • Print_ISBN
    978-1-4799-4791-1
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2014.6813796
  • Filename
    6813796