DocumentCode :
138099
Title :
Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods
Author :
Palczynska, Alicja ; Wymyslowski, A. ; Bieniek, Tomasz ; Janczyk, Grzegorz ; Pasquet, Daniel ; Thanh Vinh Dinh
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
fYear :
2014
fDate :
7-9 April 2014
Firstpage :
1
Lastpage :
10
Abstract :
Cross-talk (XT) is a phenomenon affecting signals propagated in electronic circuitry. In a general case if a signal is transmitted in one system it creates an undesired effect in another, which is due to the crosstalk. The crosstalk is usually caused by parasitic capacitances, inductances, or conductive coupling. In wireless communication, crosstalk is often denoted as a co-channel interference, and is related to adjacent-channel interference. The above is especially important for high frequency ranges, which are used in wireless RF applications. In integrated circuit design, crosstalk normally refers to a signal affecting another nearby signal. Usually the coupling is capacitive but other forms of coupling and effects on signal further away are sometimes important as well, especially in analogue and digital circuits. The main problem is how to prevent this phenomena in order to sustain the signal integrity. There are a wide variety of possible fixes, with the increased spacing, wire reordering and/or appropriate shielding. In fact it requires application of specific design rules during the prototyping stage. In the paper the experimental and numerical analysis of a crosstalk problem is presented. The experimental measurement were performed on manufactured test samples prepared on Si substrates with predefined configuration of aluminium lines / wires. Numerical modelling was based on finite element method (FEM) including both 2D and 3D simulations.
Keywords :
adjacent channel interference; cochannel interference; crosstalk; electromagnetic wave propagation; finite element analysis; adjacent-channel interference; co-channel interference; conductive coupling; crosstalk phenomena analysis; electromagnetic wave propagation; electronic circuitry; finite element method; integrated circuit design; numerical modelling; numerical simulation methods; parasitic capacitances; wireless RF applications; wireless communication; Abstracts; Impedance; Strips;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
Type :
conf
DOI :
10.1109/EuroSimE.2014.6813803
Filename :
6813803
Link To Document :
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