FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

Author

Chenniki, Walide ; Bord-Majek, Isabelle ; Levrier, B. ; Wongtimnoi, Komkrisd ; Diot, Jean-Luc ; Ousten, Y.

Author_Institution

IMS Lab., Univ. of Bordeaux, Talence, France

fYear

2014

fDate

7-9 April 2014

Firstpage

1

Lastpage

4

Abstract

In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux´s methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the optimal thermo-mechanical properties of the LCP package leading to the maximum operating lifetime. A correlation between predicted lifetime results and optimal thermo-mechanical properties of the package is obtained depending on the geometry of the QFN under study.

Keywords

copper alloys; design of experiments; electronics packaging; fatigue; finite element analysis; liquid crystal polymers; reliability; silver alloys; solders; thermomechanical treatment; tin alloys; Darveaux methodology; DoE; FEM simulations; QFN cavity package; SnAgCu; built-in reliability; design of experiments; fatigue; liquid crystal polymer; optimal thermomechanical properties; package geometry; quad flat no-lead cavity package; reliability impact; solder joint; strain energy density estimation; Abstracts; Finite element analysis; Lead; Materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on

Conference_Location

Ghent

Print_ISBN

978-1-4799-4791-1

Type

conf

DOI

10.1109/EuroSimE.2014.6813805

Filename

6813805