Title :
Characterization and modeling of the AuCuSn thin solder joint under thermal cycling
Author :
Pelisset, Tiphaine ; Karunamurthy, B. ; Otremba, Ralf ; Antretter, Thomas
Author_Institution :
KAI-Kompetenzzentrum Automobil- und Industrieelektron. GmbH, Villach, Austria
Abstract :
Thin Au2Cu6Sn2 solder joints have been identified to provide improved electrical and thermal device performance compared to thicker solder joints [1]. Both the material high thermal conductivity and the reduced joint thickness improve the thermal dissipation through the solder joint, making the thin Au2Cu6Sn2 solder layer very attractive for high power devices. In this paper, we establish a material model for the Au2Cu6Sn2 material in order to study solder thermal fatigue using finite element analysis.
Keywords :
copper alloys; finite element analysis; gold alloys; solders; thermal conductivity; thermal stress cracking; tin alloys; Au2Cu6Sn2; finite element analysis; high power devices; material high thermal conductivity; material model; reduced joint thickness; solder thermal fatigue; thermal cycling; thermal dissipation; thin solder joint; Abstracts; Gold; Heating; Materials; Performance evaluation; Temperature measurement; Tin;
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
DOI :
10.1109/EuroSimE.2014.6813832
