• DocumentCode
    138179
  • Title

    System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS

  • Author

    Kolchuzhin, Vladimir ; Mehner, J. ; Markert, Erik ; Heinkel, Ulrich ; Wagner, Christoph ; Schuster, Jorg ; Gessner, T.

  • Author_Institution
    Fac. for Electr. Eng. & Inf. Technol., Microsyst. & Precision Eng., Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2014
  • fDate
    7-9 April 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This article deals with the model development for a single walled carbon nanotube (SWCNT) piezoresistive sensor at system level design. The framework of VHDL-AMS is used for implementation and simulation, consisting of compact submodels that describe components performing heterogeneous functions. The SWCNT mechanical and electrical compact models presented in the article are based on the analytical model, lumped element model and the simulation results based on density functional theory (DFT). The macromodels of the MEMS are built using a reduced order modeling technique based on finite element simulations. This article presents and discusses the most important aspects of the development of system models and essential model parameters.
  • Keywords
    carbon nanotubes; computerised instrumentation; density functional theory; finite element analysis; hardware description languages; microsensors; mixed analogue-digital integrated circuits; nanosensors; piezoresistive devices; reduced order systems; C; DFT; MEMS; SWCNT based piezoresistive sensor; SWCNT electrical compact model; SWCNT mechanical compact model; VHDL-AMS; compact submodel; density functional theory; finite element simulation; heterogeneous function; lumped element model; macromodel; model parameter; reduced order modeling technique; single walled carbon nanotube; system level design; system level model development; Abstracts; Atomic measurements; Conductors; Couplings; Deformable models; Electrostatics; Gold;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
  • Conference_Location
    Ghent
  • Print_ISBN
    978-1-4799-4791-1
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2014.6813846
  • Filename
    6813846